Chip carrier ceramic-gold C-DIP 48pin KD-82293-C

Description

Gold plated Kyocera C-DIP 48 pin
(Ceramic dual in line package 2x24)
P.No: KD-82293-C
For full datasheet google KD-82293-C or contact me
Good for science and R&D projects, bare die and MEMS wirebonding,
general hardware hacking
Multilayer Ceramic Package
Footprint Equal to Cerdip and PDIP Packages
Through Hole Assembly - Easy Soldering and Removal Techniques
Good Heat Dissipation -Airflow Above and Below Package
Solder, Glass or Epoxy Seal
Lead Plating: Gold Dip
Price include standard, non-registered international mail delivery for single item.
No returns or complains about delivery time are accepted for standard delivery.
Other delivery methods and multiple items delivery is possible  - please contact me.