Sylvania ECG909 NTE909 IC Integrated Circuit High Gain Low Noise 8-Pin Op Amp A1

Description

Sylvania ECG909 NTE909 IC Integrated Circuit High Gain Low Noise 8-Pin Op Amp A1
Description: These devices are monolithic operational amplifiers intended for general–purpose applications. Operation is completely specified over the range of voltages commonly used for these devices. The design, in addition to providing high gain, minimizes both offset voltages and bias currents. Further, the class–B output stage gives a large output capability with minimum power drain. External components are used to frequency compensate the amplifier. Although the unity–gain compensation network specified will make the amplifiers unconditionally stable in all feedback configurations, compensation can be tailored to optimize high–frequency performance for any gain setting. The fact that the amplifiers are built on a single silicon chip provides low offset and temperature drift at minimum cost. It also ensures negligble drift due to temperature gradients in the vicinity of the amplifier. Absolute Maximum Ratings:
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18V
Power Dissipation (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250mW
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10V
Output Short–Circuit Duration (TA = +25°C)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 seconds
Storage Temperature Range  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +150°C
Operating Temperature Range  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 ° to +70°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300 °C
Note 1 For operating at elevated temperatures, the device must be derated based on a 100°C maximum junction temperature and a thermal resistance 150°C/W junction to ambient or 45°C/W, junction to case for the metal can package
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